Camera interface

The device uses a 2.0 megapixel camera module with a sensor resolution of 1600 x 1200. The following block diagram shows how a CCP bus is used to transfer image data from the camera module to the phone engine. This bi-directional control bus is a software-implemented I2C interface.

The camera regulator N1470 powers the digital parts of the camera, and a camera regulator N1471 is used for powering the analogue parts.

A CAMVCTRL signal (Vctrl) is used for activating the camera module. When the Vctrl signal is Low, the module enters the power on mode. When the signal is High, the module enters the power off mode.

A CAMCLK signal feeds the system clock for the camera module. Camera construction

This section describes the mechanical construction of the camera module for getting a better understanding of the actual mechanical structure of the module.

Table 16 Camera specifications

Sensor type

CMOS Sensor

Photo detectors

1.9 million

F number/Aperture


Focal length

4.8 mm (35 mm equivalent 37 mm)

Focus range

64 cm to infinity

Still Image resolutions

1600x1200, 640x480

Still images file format

EXIF (JPEG), *.jpg

Video resolutions

352x288, 176x144. Both at 30 frames per second

Video clip length

10 seconds or free, maximal clip length in free mode is 1 hour (limited by the data storing capabilities of the device)

Video file format

3GPP, *.3gp



White Balance


RM-180 IMOKIA System Module_Nokia Customer Care


16.7 million / 24-bit

Capture Modes

Night mode, Sequence mode, self timer

Automated Camera Module Assembly
Figure 94 Camera module cross section and assembly principle
Nokia 6681 Camera Pin Diagram
Figure 95 Camera module bottom view including serial numbering

The camera module as a component is not a repairable part, meaning that the components inside the module may not be changed. Cleaning dust from the front face is allowed only. Use clean compressed air.

The camera module uses socket type connecting. For versioning, laser marked serial numbering is used on the PWB.

The main parts of the module are:

• Lens unit including lens aperture.

• Infrared filter; used to prevent infrared light from contaminating the image colours. The IR filter is glued to the EMI shielded camera body.

• Camera body; made of conductive metallized plastic and attached to the PWB with glue.

• Sensor array including DSP functions is glued and wire-bonded to the PWB.

• Passive components

• Camera protection window; part of the phone cover mechanics

• Dust gasket between the lens unit and camera protection window

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