Keys and Keymatrix

0-9, *, #, send, end, soft_1, soft_2, power_on_off, roller_push, Headset Connector

The external headset device is connected to the system connector, from which the signals are routed to COBBA_GJP microphone inputs and earphone outputs.

Technical Documentation

Table 2. Mic signals of the system connector

NA

MICN mouted in slide

0

2

12.5

mV

Connected to COBBA_GJP MIC2N input. The maximum value corresponds toi kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value - 16 dB.

NA

MICP mounted in slide

0

2

12.5

mV

Connected to COBBA_GJP MIC2P input. The maximum value corresponds toi kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical value is maximum value - 16 dB.

Table 3. System/IBI connector

Pin

IB-pin

Name

Function

Min

Typ

Max

Unit

Description

10

Yes

XEAR

Analog audio out

47

Q

Output AC impedance (ref. GND) resistor tol. is 5%

put (from phone to accessory

10

^F

Series output capacitance

16

300

Q

Load AC impedance to GND: Headset

4.7

10

kQ

Load AC impedance to SGND: External accessory.

1.0

vp-p

Max. output level. No load

100

kQ

Resistance to accessory ground (in accessory)

Accessory detection

0.5

V

DC Voltage (ref. SGND). External accessory

(fom accessory to phone)

6.8

kQ

Load DC resistance to SGND. External accessory

0

0.2

V

DC Voltage (ref. SGND). Headset with closed switch

16

1500

Q

Load DC resistance to SGND. Headset with closed switch

2.8

V

DC Voltage (ref. SGND). No accessory, or headset with open switch

47

kQ

Pull-up resistor to VBB in phone

Table 3. System/IBI connector (continued)

Pin

IB-pin

Name

Function

Min

Typ

Max

Unit

Description

8

Yes

XMIC

Analog audio input

(from accessory to phone)

2.0

2.2

kQ

Input AC impedance

100

Q

Accessory source AC impedance

1

Vp-p

Maximum signal level

Headset micro

2.0

2.2

kQ

Input AC impedance

(from accessory to phone)

2.5

kQ

Headset source AC impedance

100

600

^A

Bias current

200

p-p

Maximum signal level

Voltage compared to SGND.

(from phone to

2.5

2.9

V

Not muted

0

1.55

V

Muted, without headset

accessory)

1.6

2.0

2.4

V

Comparator reference in accessory

(from accessory to

1.47

2.9

V

No headset (ref. SGND).

0

1.33

V

Headset connected (ref. SGND).

phone) (NO TAG)

49

kQ

Pull-up resistor to VBB in phone

9

Yes

SGND

Audio signal

47

Q

Output AC impedance (ref. GND)

ground. Separated from phone

10

Series output capacitance

380

Q

Resistance to phone ground (DC) (in phone)

(from phone to accessory)

100

kQ

Resistance to accessory ground (in accessory)

-0.2

+0.2

V

DC voltage compared to phone GND

-5

+5

V

DC voltage compared to accessory Gnd

Technical Documentation

Table 3. System/IBI connector (continued)

Pin

IB-pin

Name

Function

Min

Typ

Max

Unit

Description

13

Yes

FBUS _TX

Serial data out (from phone to accessory)

0.1

0.8

V

Output low voltage @ Iol < 4 mA (ref. GND)

1.7

2.8

V

Output high voltage @ Ioh < 4 mA (ref. GND)

47

kQ

Pull-up resistor in phone

220

kQ

Pull-down resistor in accessory

47

100

Q

Serial (EMI filtering) resistor in phone

150

pF

Cable capacitance

1

^s

Rise/Fall time

12

Yes

FBUS _RX

Serial data in (from accessory to phone)

0

0.8

V

Input low voltage (ref. GND)

2.0

2.8

V

Input high voltage (ref. GND)

220

kQ

Pull-down resistor in phone

47

kQ

Pull-up resistor in accessory

2.2

kQ

Serial (EMI filtering) resistor in accessory

150

pF

Cable capacitance

2

^s

Rise/Fall time @ 115kbits/s

1

^s

Rise/Fall time @ 230kbits/s

11

FLAS H CL K

Bidirectional serial bus

Flash serial data clock (from accessory to phone)

0

0.8

V

Input low voltage (ref. GND)

2.0

2.8

V

Input high voltage (ref. GND)

0

0.8

V

Output low voltage @ Iol < 4 mA (ref. GND)

2.1

2.9

V

Output high voltage @ Ioh < 100 ^A (ref. GND)

4.7

kQ

Pull-up resistor in phone

220

kQ

Pull-down resistor in accessory

100

Q

Serial (EMI filtering) resistor in phone

200

pF

Cable capacitance

5

^s

Rise/Fall time @ 9600 bits/s

Table 3. System/IBI connector (continued)

Pin

IB-pin

Name

Function

Min

Typ

Max

Unit

Description

2, 14

L GN D

Logic and charging ground (separated from phone GND by EMI components)

0

1.0

A

Ground current

4,5

-

CHRG CTR

Charger control

0

0.8

V

Output low voltage @ IOL < 20 ^A

L

(from phone to accessory

1.7

2.9

V

Output high voltage @ IOH < 20 ^A

32

37

Hz

PWM frequency

1

99

%

PWM duty cycle

20

kQ

Serial (EMI filtering) resistor in phone

30

kQ

Pull-down resistor in phone

1,3

-

VIN

Fast

0

8.5

V

Charging voltage.

charger (from accessory to phone)

0

0.85

A

Charging current.

100

p-p

Ripple voltage @ f = 20...200Hz, load = 3 & 10 Q

100

p-p

Ripple voltage @ f = 0.2...30 kHz, load = 3 & 10 Q

100

p-p

Ripple voltage @ f > 30 kHz, load = 3 & 10 Q

200

p-p

Total ripple voltage @ f > 20 Hz, load = 3 & 10 Q

Slow charger (fom ac-

0

15

Vpea k

Charging voltage (max. = unloaded, +20 % overvoltage in mains).

cessory to phone)

0

1.0

Apea k

Charging current (max. = shorted, +20 % overvoltage in mains).

Technical Documentation

COBBA GJP

AUX OUT

AGND AGND

COBBA GJP

AUX OUT

HFCM

AGND

MIC1N

j J100n

MIC1P

j J100n

MIC3N

j J100n

MIC3P

R01= 100R

C01=33uF

C02=1000pF

C03=22pF

L01=MMZ2012Y6

01BT/TDK

Note 1: Grey resistor are in the border of "EMI clean" and "dirty" areas. Note 2: AGND is connected directly to the GND on PCB close to HF parts. Note 3: ESD protection diodes are not shown.

Figure 3. Combined headset, system connector audio signals

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