CMT Module MA

[This page left intentionally blank]

Table of Contents

Page No

Glossary of Terms 6

MA4 Module Summary 10

Baseband 10

Technical Summary 10

External Signals and Connectors 11

Test Flash-Connector (X201) 12

Battery Connector (X203) 13

SIM card connector (X400) 13

Internal Signals and connections 14

36-pin board to board connector 14

Power Distribution 16

Battery Charging 17

PWM 19

Battery identification (BSI) 19

Battery temperature (BTEMP) 21

Supply voltage regulators 21

Switched mode power supply VSIM 23

Power Up and Power Down 24

Power up with a charger 24

Power up with power switch (PWRONX) 25

Power up by RTC 26

Power up by IBI 26

Power Down 26

Modes of Operation 27

Acting Dead 27

Active Mode 27

Sleep Mode 27

Charging 27

Watchdog 28

Digital Control 29

Program and Data Memory 29

Work Memory 29

MCU Memory Map 30

Flash Programming 30

COBBA GJP 30

Real time clock 30

RF Module 32

Maximum Ratings 32

RF Characteristics 32

DC characteristics 32

Regulators 32

Frequency Synthesizer 33

Receiver 33

Transmitter 34

AGC strategy 35

AFC function 35

DC-compensation 35

Receiver Characteristics 36

Transmitter Characteristics 36

User Interface features 37

Power key 37

Backlight for display and keyboard 37

UI switch 37

Audio and Vibrator 38

Audio Function Description 38

Internal Audio Devices 39

Ear Piece 39

Earpiece Electric Interface 40

Microphone 40

Buzzer 40

Buzzer Electric Interface 40

Audio Accessories 42

External Mono Audio Interface 43

External Mono Audio Interface — Electrical Interface 44

External Mono Audio Connector (on the UI module) 44

External Audio Signal Electrical Specifications 45

Accessory Detection, Identification and Control 45

Accessory Detection 45

Accessory Identification 46

Accessory Control 46

Accessories Electric Specifications 47

Vibra Alerting Device 47

Parts Lists 49

CMT module MA4 (0201794) 49

List of Figures

Page No

Fig 1 Block Diagram of MA4 10

Fig 2 X203 Battery Pads 13

Fig 3 36-pin board-to board connector 14

Fig 4 Baseband Power Distribution 17

Fig 5 BSI Connections - All Batteries 20

Fig 6 SIMCardDetX Detection Levels 20

Fig 7 Standard Battery, BTEMP Connection 21

Fig 8 Output overvoltage protection when the battery is removed 22

Fig 9 SMR Power Functions 23

Fig 10 Power Up with Charger 25

Fig 11 Power-up with switch 26

Fig 12 Flash Programming Sequence 30

Fig 13 Power Distribution Diagram 33

Fig 14 Audio /Vibrator Schematic 38

Fig 15 Audio Block Diagram (version 4) 39

Fig 16 Buzzer Electrical Interface 40

Fig 17 External Audio Interface- Block Diagram 43

Fig 18 4 Pole Jack plug for audio accessories 45

Fig 19 Vibrator Electrical Interface 47

Schematics/Layouts

RF-BB Connections Schematic Diagram, Version 4.0 A3 - 2

Audio & RFI Schematic Diagram, v.01 ed.101 A3 - 4

CPU Schematic Diagram, v.03 ed.119 A3 - 5

Power and Charging Schematic Diagram, v.04 ed.210 A3 - 6

User Interface Schematic Diagram, v.04 ed.109 A3 - 7

RF Schematic Diagram, v.04 ed.109 A3 - 8

Parts Placement Diagram, 1/2, Version 4.0 A3 - 9

Parts Placement Diagram, 1/2, Version 4.0 A3 - 10

Glossary of Terms

ACCIF ACCessory InterFace block of MADLinda

A/D Analog-to-Digital

ADC Analog-to-Digital Converter

AFC AutomaticFrequencyControl

AGC Automatic Gain Control

ARM Advanced RISC Machines

ASIC Application Specific Integrated Circuit

AVG Average

BB Baseband

BGA Ball Grid Array package

CCONT Multifunction power management IC for DCT3

CHAPS DCT3 Charging control ASIC

CMT Cellular MobileTransceiver

COBBA DCT3 RF-interface and Audio codec IC

COBBAfGJP Serial control interface version of COBBA

CRFU3 UHF RF IC - used in bl8 RF HW

CSD Card-specific Data, register in MultiMediaCards

CSP Chip Scale Package

CTSI Clocking, Timing, Sleep ft Interrupt block of MADLinda

D/A Digital-to-Analog

DAC Digital-to-Analog Converter

DCD Data Carrier Detect

DCE Data Communication Equipment

DCT3 3rd generation Digital Core Technology

DTMF

FBUS

GPIO

HAGAR

HSCSD

IrDA LCD LEAD

Differential non-linearity

Direct Memory Access

RAE-3 Color UI module

Digital Signal Processor

Dual Tone Multi Frequency

Data Terminal Ready

External Accessory Detect

Electromagnetic Compatibility

Electromagnetic Interference

Electrostatic Discharge

Full Duplex Serial Bus in NOKIA's phones

Flash File System

General Purpose Input/Output

Directconversion RFASIC

Hands Free

High Speed Circuits Switched Data

Hardware

Integrated Circuit

Integral non-linearity

Input/Output

Infrared

Infrared Data Association

Liquid Crystal Display

Low power Enhanced Architecture DSP

LNA Low Noise Amplifier

MAD MCU+ASIC+DSP chip (MCU-ASIC-DSP)

MAD2 GSM version of MAD

MBUS 1-wire half duplex serial bus in NOKIA's phones

MCU Micro ControllerUnit

MMU MemoryManagementUnit

MPU Micro Processor Unit

NTC Negative Temperature Coefficient (resistor)

PCI PhoneControllnterface

PCM Pulse Code Modulation

PLL Phase Locked Loop

PWB Printed Wiring Board

PWM Pulse Width Modulation

R&D Research and development

RAM Random Access Memory

RF Radio Frequency

RFI RF Interface

ROM ReadOnlyMemory

RTC Real Time Clock

SDRAM Synchronous Dynamic RAM

SIM Subscriber IdentifyModule

SW Software

UI User Interface

VCTCXO Voltage Controlled Temperature Compensated Oscillator

VCXO Voltage Controlled Oscillator

MA4 Module Summary

This section describes the system (CMT) module MA4. The module comprises the RF and baseband functions of the phone.

Baseband

Vbat Nokia Diagram
Figure 1: Block Diagram of MA4

Technical Summary

The baseband module includesfourASICs: CHAPS, CCONT, COBBA-GJPand MAD2WD1, which take care of the baseband functions of the engine. All the ASICs are in uBGA package. EEPROM is software emulated in the Flash-memory.

The baseband is designed for direct conversion RF. The baseband is running from a 2.8V power rail (VBB), which is supplied by a power controlling ASIC CCONT.

The CCONT comprises 6 individually controlled regulator outputs for RF-section and two outputs for the baseband. In addition, there is one +5V power supply output (V5V). The CCONT also comprises a SIM interface, which supports both 3V and 5V SIM-cards. A real time clock function is integrated into the CCONT, which utilizes the same 32kHz clock supply as the sleep clock. The battery charging is controlled by a PWM-signal from the CCONT.

The baseband architecture supports a power saving function called "Sleep-mode". In Sleep-mode, the VCTCXO is shut off, which is used as system clock source for both RF and baseband. During the Sleep-mode, the system runs from a 32 kHz crystal.

The phone is waken up by a timer running from this 32 kHz clock supply. The sleeping time is determined by network parameters. The sleep mode is entered when both the MCU and the DSP are in standby mode and the normal VCTCXO clock has been switched off.

The MAD2WD1 is a dual voltage circuit using VBB (2.8V Baseband supply) and VCORE (1. 750V. Core Voltage supply for MAD2WD1 ver. C06).

The COBBA ASIC mainly handles the interface between the baseband and the RF section. The COBBA provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface.

The COBBA supplies the analog TXC and AFC signals to RF section according to the MAD2WD1 DSP digital control. Data transmission between the COBBA and the MAD2WD1 is implemented using serial bus for high speed signaling and for PCM coded audio signals.

Digital speech processing is handled by the MAD2WD1 ASIC. The COBBA is a dual voltage circuit, the digital parts are running from the baseband supplyVBB (2.8V) and the analog parts are running from the analog supplyVCOBBA (2.8V).

The baseband supports both internal and external microphone inputs and speaker outputs. The COBBA selects the source and controls the gain of the input and output signals according to control messages from the MAD.

The MAD generates and encodes the keypad tones, DTMF and other audio tones which then are routed to the COBBA for decoding,

Ul-Switch N400 is used as HW-driver for the LEDs, Buzzer and Vibra.

The MAD2WD1 generates the Buzzer and Vibra (internal) alert control signals with separate PWM outputs.

IrDa is not supported.

The phone can be re-flashed in Aftersales using the 4-poled 'Test Flash Connection' pos.: X201 and a Service battery.

EMC shielding is implemented using three metal cans: two for the RF and one for the Baseband. Heat generated by the circuitry is conducted out via the PWB ground planes.

External Signals and Connectors

This section describes the external electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that cover a connector or a defined interface.

Test Flash-Connector (X201)

The Test Flash-Connector is used as a flash programming interface for updating (i.e. reprogramming) the flash program memory and as an electrical interface for access to the engine by a service tool (e.g. WinTesla). This Interface is used by Aftersales via a 'Service battery'. Refer to Table 1, "Test Flash-Connector," on page 12

The Connector is made via 4 Test Pads which are accessible through the mechanic of the phone when the Battery is removed.

When the flash programming-tool is connected to the phone (via 'Service battery BBSS'), supply power is provided through the battery contacts and the phone is powered up with an IBI-pulse given to the BTEMP line.

Note: ESD protection is applied to all pads of X201.

Table 1: Test Flash-Connector

Note: ESD protection is applied to all pads of X201.

Table 1: Test Flash-Connector

Pin

Name

Parameter

Min.

Typ

Max

Unit

Remark

1

FBUS_TX

Data ack. to the Prommer

2.24

logic low logic high

0.62 2.85

V

Transmit Data from MAD2WD1 (AccTxData) to Prommer (@ VBB=2,85V)

2

FBUS_RX

Serial data from the Prommer

0 1,68

logic low logic high

0.84 2.85

V

Receive Data from Prommer to MAD2WD1 (AccRxData) (@ VBB=2,85V)

3

GND

GND

0

0

V

Ground

4

MBUS

Serial clock from the Prom-mer

0 1,68

logic low logic high

0.84 2.85

V

Prommer detection and Serial Clock for synch. Comm. to MAD2WD1 (MBUS) (@ VBB=2,85V)

Battery Connector (X203)

The electrical specifications for the battery connector are shown in Table 2, "Battery Connector," on page 13. The BSI contact on the battery connector is used to detect when the battery is removed. This is to be able to shut down the operations of the SIM card before the power is lost ifthe battery is removed with power on.

The BSI contact disconnects earlier than the supply power contacts to give enough time for the SIM shut down

Table 2: Battery Connector

Pin

Name

Min.

Typ

Max

Unit

Notes

1

VBATT

3.1

3.6

5.2

V

Battery voltage

2

BSI

0

2.85

V

Battery size indication Phone has 150kohm pull up resistor. SIM Card removal detection (Threshold is [email protected])

2,2

51

Kohm

"Nickel Battery" Size indication resistor

22

Kohm

"Service Battery" indication resistor

56

130

Kohm

"4.2v Lithium Battery" Size indication resistor

3

BTEMP

0

1.4

V

Battery temperature indication Phone has a 100k (+-5%) pullup resistor, Battery package has a NTC pulldown resistor.

5

10

3 20

V ms

Phone power up by battery (input) Power up pulse width (IBI)

4

GND

0

0

V

Battery Ground is connected directly to GND.

PA Shield-Can

X203, Batery Pads

D 12 S4

RF Shield-Can

Figure 2: X203 Battery Pads

SIM card connector (X400)

The SIM l/F does not support other voltages than 3V and 5V. Refer to Table 3, "SIM Connector," on page 14

The SIM card connector is located outside the BB-shield can close to the System Connector.

Table 3: SIM Connector

Pin

Name

Parameter

Min.

Typ

Max

Unit

Notes

1

SIMCLK

Frequency

3.25

MHz

SIM clock

Trise/Tfall

25

ns

2

SIMRST

5V SIM Card

4.0

"1"

VSIM

V

SIM reset

3V SIM Card

2.8

"1"

VSIM

3

VSIM

5V SIM Card

4.8

5.0

5.2

V

Supply voltage

3V SIM Card

2.8

3.0

3.2

4

GND

GND

0

0

V

Ground

5

VSIM

5V SIM Card

4.8

5.0

5.2

V

Supply voltage

3V SIM Card

2.8

3.0

3.2

6

DATA

5V Vin/Vout

4.0

"1"

VSIM

V

SIM data

0

"0"

0.5

Trise/Tfall max 1us

3V Vin/Vout

2.8

"1"

VSIM

0

"0"

0.5

VSIM supply voltages are specified to meet type approval requirements regardless the tolerances in components.

Internal Signals and connections

36-pin board to board connector

CMT module has landing pads for 36-pin spring connector. See "Board -to board connector pins" on page 15. Below picture shows its placement on bottom layer of PWB. View is taken from bottom side. Below this 36-pins spring connector pads are production flash connectors round pads.

Figure 3: 36-pin board-to board connector

36-pin B-toB

36

connector

pads

Pin numbering goes from pin 1 to left. Pin 36 is just above pin 1.

Table 4: Board -to board connector pins

Pin

Name

Min.

Typ

Max

Unit

Notes

1

PURX

0

VBB

V

Power up reset from radio module, active low

2

CHRGR+

0

8.4

16.9

V

Raw charging voltage from charge connector on ui board to charge IC on phone PWB

3

LCDRSTX

0.7xVBB

low high

0.3xVBB VBB

V

LCD Reset output Active low

4

GND

0

0

0

V

5

GENSI0(0)

0.7xVBB

low high

0.3xVBB VBB 4

MHz

LCD Serial clock output

6

VBB

2.7

2.8

2.85

V

Regulated supply voltage from phone, only for I/O voltage reference and phone power on indication

7

GENSI0(1)

0.7xVBB

low high

0.3xVBB VBB

V

LCD Serial data output

8

VB

3.1

3.6

5.2

V

Supply voltage from battery

9

LCDENX

0.7xVBB

low high

0.3xVBB VBB

V

LCD Chip select output Active low

10

R0W5

0.7xVBB

low high

0.3xVBB VBB

V

LCD Control input

11

VB

3.1

3.6

5.2

V

Supply voltage from battery

12

R0W4

0.7xVBB

Low high

0.3xVBB VBB

V

General purpose input or output pin to radio module.

13

R0W3

0.7xVBB

Low high

0.3xVBB VBB

V

General purpose output pin to radio module.

14

GND

0

0

0

V

15

R0W2

0.7xVBB

Low high

0.3xVBB VBB

V

General purpose input pin to radio module

16

KBDLEDS

0

VBB

V

Keyboard led drive current sink (60mA) for 4 LEDS

17

LCDLEDS

0

VBB

V

Display led drive current sink (60mA) for 4 LEDS

18

VBB

2.7

2.8

2.85

V

Regulated supply voltage from phone, only for I/O voltage reference and phone power on indication

19

CHRGR+

0

8.4

16.9

V

Raw charging voltage from charge connector on ui board to charge IC on phone PWB

20

VB

3.1

3.6

5.2

V

Supply voltage from battery

Pin

Name

Min.

Typ

Max

Unit

Notes

21

FBUSRX

O 1.68

Low high

O.84 2.85

V

Serial interface between UI and radio module.

Output from UI module

22

MBUS

O 1,68

low high

O.84 2.85

V

Prommer detection. (@

VBB=2,85V)

23

FBUSTX

2.24

Low high

O.62 2.85

V

Serial interface between UI and radio module.

Input to UI module

24

GND

O

O

O

V

25

XMICN

External Microphone -

HS(5)

26

XMICP

External Microphone +

HS(7)

27

GND

O

O

O

V

28

XEARP

External Earpiece +

HS(8)

29

XEARN

External Earpiece -

HS(6)

3O

GND

O

O

O

V

31

EAR-

Internal Earpiece -

HS(2)

32

EAR+

Internal Earpiece +

HS(1)

33

GND

O

O

O

V

34

MIC-

Internal Microphone -

HS(3)

35

MIC+

Internal Microphone +

HS(4)

36

GND

O

O

O

V

In normal operation, the baseband is powered from the phone's battery.

An external charger can be used for recharging the battery and supplying power to the phone.

The baseband contains parts that control power distribution to whole phone excluding those parts that use continuous battery supply. The battery feeds power directly to the CCONT and UI (buzzer and LEDs for display/ keyboard). Figure 4, "Baseband Power Distribution," on page 17 shows a block diagram of the power distribution.

The power management circuit CHAPS provides protection against over-voltages, charger failures and pirate chargers etc. that would otherwise cause damage to the phone.

PA SUPPLY r-

RF SUPPLIES

VCOBBA

DIY Battery Repair

DIY Battery Repair

You can now recondition your old batteries at home and bring them back to 100 percent of their working condition. This guide will enable you to revive All NiCd batteries regardless of brand and battery volt. It will give you the required information on how to re-energize and revive your NiCd batteries through the RVD process, charging method and charging guidelines.

Get My Free Ebook


Post a comment